ABB DSAI133A 3BSE018290R1 High‑density Analog Input Module

Technical Specifications

• Model: DSAI133A

• Part Number: 3BSE018290R1

• Brand: ABB

• Product Type: Temperature analog input module

• Input Channels: 16 channels

• Supported Signal: Thermocouple(J,K,T,E,B,R,S,N), RTD Pt100, Pt1000

• Resolution: 14‑bit A/D conversion

• Measurement Accuracy: ±0.2% full‑scale typical

• Isolation: Group galvanic isolation between field side and system bus

• Cold‑junction Compensation: Built‑in automatic cold‑junction compensation for thermocouple

• System Bus: Advant Master internal rack backplane bus

• Power Supply: Rack backplane power supply

• Operating Temperature: ‑20℃ ~ +70℃

• Protection Class: IP20

• Weight: 0.52 kg

• Mounting: Rack‑slot installation

• Compatible System: ABB Advant Master DCS

• Core Function: Collect thermocouple and RTD temperature signals, convert temperature analog signals into digital data for controller processing

Product Details

The DSAI133A 3BSE018290R1 is dedicated Thermal‑signal Analog Input Module for ABB Advant Master DCS platform, it acts as professional Temperature Acquisition Processing Board for industrial temperature monitoring scenarios.

This module supports multiple thermocouple types and Pt series thermal resistance signals. Built‑in automatic cold‑junction compensation circuit ensures accurate thermocouple temperature measurement. 14‑bit high‑precision A/D converter completes analog‑digital conversion. Group isolation structure effectively suppresses field ground‑loop interference and improves stability of temperature sampling. Collected digital temperature data is transmitted to main CPU through rack backplane bus for logic calculation and alarm judgment.

Front‑panel LED indicators display module running status and channel fault information. Built‑in diagnosis function can detect sensor open‑circuit, short‑circuit and hardware abnormal conditions. Fault alarms will be uploaded to DCS host system. Users can configure sensor type and measuring range via Advant engineering software.

Adopting standard rack‑slot mechanical structure, it can work with CPU, communication boards and other I/O modules in one control rack. Widely deployed in thermal power, petrochemical, metallurgy and pulp‑paper industries. It is essential temperature acquisition hardware for temperature point expansion, sensor loop reconstruction and defective analog input module replacement for legacy Advant Master automation projects.