BPGA-0057 BPGA Test Socket Adapter Unit

Feature & Principle

This BPGA test socket provides stable electrical connection between test board and BGA chip. It adopts high conductivity contact pins, with pressure balancing structure, ensures consistent signal transmission during high temperature burn-in and functional test. It supports repeated loading and unloading of chips, isolates mechanical stress to protect chip solder balls.

Specifications

Model: BPGA-0057 Type: BPGA test socket Package: BGA Application: IC burn-in / functional test Contact material: High performance spring probe Operating temperature: -40 ~ +150℃ Impedance control: High speed signal compatible Certification: Semiconductor test standard

Components & Diagnostics

Socket housing, spring contact pins, compression cover, positioning guide block and PCB mounting base. Common faults: pin spring fatigue, poor contact, signal open/short, positioning deviation.

Product Brief

BPGA-0057 test socket, semiconductor test spare widely used for memory, logic IC and power chip burn-in test platform.